Asia Express - East Asian ICT
Intel to Build New Semiconductor Packaging Facility in Malaysia for US$7 Billion
December 16, 2021

Intel recently announced that the company will invest US$7 billion in a new chip packaging technologies in the northern state of Penang, Malaysia, the Reuters reported on December 16. The new plant is slated for mass production in 2024 to create over 4,000 Intel jobs and more than 5,000 construction jobs in the country. The Malaysian chip assembly industry has accounted for one-tenth of the global trade worth over US$20 billion. The shortage is expected to continue into 2023. Production value of the Taiwanese packaging and testing industry is estimated to reach NT$573.5 billion (US$20.9 billion) in 2021, according to MIC (Market Intelligence & Consulting Institute), a major government think tank and leading IT research institute in Taiwan. Taiwan’s packaging and testing industry ranks the world’s first and accounts for 62.5% of the global industry.